Corning Incorporated will showcase its latest innovations in optical infrastructure, including the newest additions to its award-winning Evolv™ portfolio, at the 2021 Fiber Connect conference. Experts will share insights on how network operators can stay ahead of demand for reliable, high-bandwidth connectivity.
The latest Evolv solutions include a terminal that supports additional fiber configurations, designed to enable the fiber-lean distributed tap architectures sometimes used in rural deployments. Like other terminals in the Evolv portfolio, the new terminal offers easy-to-use Pushlok™ technology.
“Today, the benefits of a fiber broadband connection are clearer than ever, and network operators are working to bring more connections to more people in more places,” said Joe Jensen, director, Americas, fiber-to-the-home market development for Corning. “Our industry-leading products, including our Evolv portfolio, offer network operators enhanced deployment flexibility at a lower cost.”
At the conference, Corning experts will explain how Corning can help operators support transformative technologies such as 5G, artificial intelligence, and the Internet of Things.
Corning is one of the world’s leading innovators in materials science, with a 170-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people’s lives.
Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries.
Corning’s capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning’s markets include optical communications, mobile consumer electronics, display, automotive, and life sciences.