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Tessolve

India’s Tessolve surpasses ₹1,000 crore revenue mark

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Tessolve, a global semiconductor and embedded engineering company for next-generation products, impressively surpassed ₹1,000 crore in revenue earlier this year, marking a significant milestone...
Infineon

Power Semiconductors | Infineon, HD KSOE develop ship electrification tech

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Infineon Technologies AG and HD Korea Shipbuilding & Offshore Engineering Co. Ltd. have signed a non-binding Memorandum of Understanding (MoU) as a first step...
Sasken Technologies

Sasken Joins Qualcomm IoT Accelerator Program

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Sasken Technologies, a global enabler in cutting-edge technology solutions, is excited to announce a collaboration with Qualcomm Technologies, Inc., a pioneer in wireless technologies,...
NXP

NXP unveils i.MX 91 applications processor family

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NXP Semiconductors has announced the i.MX 91 applications processor family. Building on more than two decades of leadership in developing multi-market applications processors, the...
Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption in autonomous driving. As more sensors are needed for autonomy, there are increasing needs for faster signal processing, reduced device costs and smaller form factors. Functional safety is also critical for many of these autonomous applications. To address these market needs, we’re introducing two additions to our AMD Automotive XA Artix™ UltraScale+™ family: the XA AU10P and XA AU15P cost-optimized processors, which are automotive-qualified and optimized for use in advanced driver-assistance systems (ADAS) sensor applications. The Artix UltraScale+ devices extend the AMD portfolio of automotive-grade, functional-safety proven and highly scalable FPGA and adaptive SoCs, joining the automotive-grade Spartan™ 7, Zynq™ 7000 and Zynq UltraScale+ product families. XA Artix UltraScale+ processors are certified for functional safety up to ASIL-B, which is critical for automotive ADAS sensors from cameras to LiDARs, enabling our customers—carmakers, robotaxi developers and Tier 1 suppliers—to accelerate development of autonomous vehicles. “As automotive systems have grown in complexity, safety is more critical than ever before with automotive OEMs and Tier 1 suppliers requiring ASIL-B certification for LiDAR, radar and smart edge sensor applications,” said Ian Riches, vice president, global automotive practice, TechInsights. “Through the release of the new XA Artix UltraScale+ devices, AMD is demonstrating its continued commitment and investment in the latest functional safety solutions to serve the automotive market.” Customers are already designing next-gen ADAS edge systems based on the new devices, including a leading LiDAR company, which will deploy XA Artix UltraScale+ devices for autonomous applications. Automotive designers can use these devices for sensor fusion, bringing in data from multiple edge sensors and performing image and video processing before porting it to an external SoC. Additionally, the new XA Artix UltraScale+ devices can be connected to multiple displays in the vehicle to enhance infotainment features. Shipping now, these new, cost-optimized XA Artix FPGAs offer high serial bandwidth and signal compute density in an ultra-compact form factor. Artix UltraScale+ devices maximize system performance via DSP bandwidth for cost-sensitive and low-power ADAS edge applications including networking, vision and video processing and secure connectivity. AMD in Automotive As the pace of innovation continues to accelerate in the automotive industry, the need for high-performance compute, compute acceleration and graphics technologies is increasing. AMD is at the forefront of this inflection point, with the industry’s broadest line of high-performance CPUs, GPUs, FPGAs and adaptive SoCs. From powering in-vehicle infotainment systems to advanced driver-assistance systems, autonomous driving and networking applications where functional safety is of paramount

AMD unveils two additions to its Automotive XA Artix Family

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Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption...
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NXP, TSMC to Deliver Automotive 16 nm FinFET Embedded MRAM

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NXP Semiconductors, the global enabler in automotive processing, has announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random...
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Samsung Achieves LCA Verification on Product Carbon Footprint for Semiconductors

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Samsung Electronics a global enabler in advanced semiconductor technology, has established a Life Cycle Assessment (LCA) on the product carbon footprint of its semiconductor...

Innodisk DDR5 RDIMM Powers Semiconductor Automatic Optical Inspection

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Innodisk, a global enabler in industrial-grade storage and embedded peripherals is proud to announce its solution to issues faced by Automated Optical Inspection (AOI)...
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Radisys Debuts Support for AMD EPYC Processors

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Radisys® Corporation, a global enabler of open telecom solutions, has announced its support of AMD EPYC™ processors on the Radisys Engage portfolio of digital...
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Mercedes-Benz, Qualcomm Partner on Digital Chassis Solutions

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Mercedes-Benz AG and Qualcomm Technologies, Inc. today announced the companies’ work to utilize Snapdragon® Digital Chassis™ solutions to bring the latest and most digitally...
Qualcomm Logo

Qualcomm’s Automotive Design-Win Pipeline Expands to $30 Billion

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Qualcomm Incorporated announced at its inaugural Automotive Investor Day that the Company’s automotive design-win pipeline has grown to $30 billion, driven by increased adoption...

Microchip Unveils Terabit-Scale Secure Ethernet PHY Family

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The demand for increased bandwidth and security in network infrastructure driven by growth in hybrid work and geographical distribution of networks is redefining borderless...
Bose Logo

Qualcomm, Bose Partner to Elevate Wireless Audio Experiences

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At IFA 2022 in Berlin, Qualcomm Technologies, Inc., and Bose highlighted their continued collaboration and longstanding relationship during Cristiano Amon’s opening keynote. Bose is...
Meta

Qualcomm, Meta Partner to Deliver Multi-Gen Metaverse Experiences

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At IFA 2022 in Berlin, Qualcomm Technologies, Inc. and Meta Platforms, Inc. announced a multi-year agreement to collaborate on a new era of spatial...

President Biden Signs Order to Implement Chip Funding

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President Biden has signed an Executive Order to implement the semiconductor funding in the bipartisan CHIPS and Science Act of 2022. This legislation will...

Samsung Unveils New Semiconductor R&D Complex in Giheung

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Samsung Electronics broke ground for a new semiconductor research and development complex in Giheung, Korea, aiming to extend its leadership in state-of-the-art semiconductor technology. Samsung...
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NXP India Launches Women in Tech program

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NXP India, one of the biggest R&D centers for NXP Semiconductors welcomes the women changemakers by launching the WOMEN IN TECH (WIT) program. To...

Broadcom Ships Tomahawk 5 Ethernet Switch Chip

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Broadcom Inc. has delivered the StrataXGS® Tomahawk® 5 switch series, providing 51.2 Terabits/sec of Ethernet switching capacity in a single, monolithic device, double the...
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MediaTek Joins GSA as new Executive Member

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The Global mobile Suppliers Association (GSA) has announced that MediaTek, a global fabless chipmaker, has joined the industry association representing the global 4G and...
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Semtech Corporation Set to Acquire Sierra Wireless

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Semtech Corporation, a global supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, and Sierra Wireless, Inc., a world-renowned Internet of Things (IoT)...
TelecomDrive