Topic: Qualcomm

Qualcomm Technologies, Inc. has announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly™ C1000 CPU, Qualcomm® High Bandwidth Compute (HBC), Qualcomm Dragonfly™ AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership.

Qualcomm Technologies Inc. has announced at Augmented World Expo the Snapdragon® Reality Elite Platform, designed to power immersive spatial computing experiences with stunning visual fidelity and deeply integrated on-device AI across a spectrum of form factors. It will power high-performance all-in-one video-see-through (VST) headsets and lightweight tethered optical-see-through (OST).