Qualcomm Debuts Advanced Connectivity Solutions for IoT Era


Qualcomm has secured more than 100 design wins across more than 60 original equipment manufacturers (OEMs) and module OEMs based on its MDM9x07 chipset family comprised of the Qualcomm® Snapdragon™ X5 LTE (9×07) modem and MDM9207-1 modem for the Internet of Things (IoT).

The flexible chipset family offers security-focused and optimized cellular connectivity, as well as edge processing for a large array of devices and systems within the IoT. These modems are designed to address customer connectivity and power challenges in a wide range of use cases including in smart cities, commercial applications and industrial designs.

These uses include smart energy & metering, building security, infrastructure, industrial control and automation, retail point of sale, asset tracking, medical, lighting and aftermarket telematics.

The Snapdragon X5 LTE modem (9×07) with All Mode capability, supports LTE Category 4 download speeds up to 150 Mbps. The MDM9207-1 modem offers LTE Category 1 support for up to 10 Mbps on the downlink, power save mode (PSM) and up to 10 years of battery life from two AA batteries.

These modems are designed to be compatible with major cellular standards across the globe, and include Linux OS support, ARM Cortex A7 processor, pre-integrated support for Qualcomm® VIVE™ 802.11ac Wi-Fi with MU-MIMO technology, Bluetooth 4.2, Bluetooth Low Energy, and integrated GNSS.

Engineered to offer design simplicity, this chipset supports scalable software reuse across the chipset platform in order to reduce design complexity, ease development costs and enable faster time to commercialization.

The rapid growth of the IoT is driving a massive new ecosystem of smart, cellular connected machines and things, and with that a wide range of connectivity requirements. Qualcomm Technologies is helping to evolve LTE to deliver a unified, scalable IoT platform. Beyond wide-area coverage, cellular networks deliver numerous benefits to IoT applications including ubiquitous coverage, scalability to address the wide range of IoT use cases, managed and predictable quality of service, high reliability, robust end-to-end security, seamless interoperability backed by global standards and coexistence with deployed and planned LTE infrastructure.

“Our LTE modems for IoT allow us to bring customers the power and flexibility of the same modem core technology already launched in hundreds of millions of devices globally so that they can address a broad range of commercial and industrial applications where wide area cellular connectivity adds a tremendous benefit,” said Serge Willenegger, senior vice president, product management of Qualcomm Technologies, Inc. “Our momentum demonstrates the widespread acceptance of our LTE IoT solutions in many fast growing IoT areas, as we help make industries around the world more connected, efficient and sustainable than ever before.”

“Qualcomm Technologies has a long history of leadership in connectivity and we are thrilled to be able to use their expertise in LTE for the IoT space,” said Mr. Vincent Wang, CEO at NEOWAY. “With their LTE IoT modems, Qualcomm Technologies is enabling our solutions to be the most advanced and helping drive the ecosystem of smart, connected devices forward.”

“As a dedicated M2M/IoT wireless module supplier, we are always looking for new ways to innovate and accelerate growth,” said Delbert Sun, marketing director of Quectel. “With Qualcomm Technologies, we see a great opportunity to make our IoT and mobile broadband modules more cost efficient by minimizing our up-front capital expenditures thus allowing Quectel to continue to focus its resources on quality and performance.”

“Telit has leveraged the power and flexibility of the Qualcomm MDM9x07 chipset and its variants across broad IoT markets. We have been able to address MNO requirements quickly and across many geographies with products ranging from LTE Cat 1 to Cat 4 today, with a path to 3GPP Rel13 MTC technologies like LTE Cat M1 and LTE Cat NB-1 for the future, both in single-mode and multimode variants,” said Ronen Ben-Hamou, EVP of products and solutions, Telit. “Qualcomm Technologies chipsets share a large number of common software elements which assures Telit’s trademark application software cross-compatibility among our IoT Modules, so that our customers can easily re-use applications and launch new products into different markets.”

“ZTE and Qualcomm Technologies have collaborated together for many years, and we’re pleased to have the opportunity to do so again with their LTE IoT modems,” said Gu Yongcheng, vice president of ZTE corporation and CEO of ZTE Welink. “As we continue to implement connectivity solutions for the IoT and M2M applications, the new chipset platform makes it possible to provide more cost-effective devices with a shorter time-to-launch.”

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