Driving innovation ahead in the connected car space – Broadcom Corporation, a global innovation provider in semiconductor solutions for wired and wireless communications, has unveiled two new connectivity chips in its automotive portfolio.
Broadcom’s automotive-grade wireless chips, featuring the latest in 5G WiFi and Bluetooth Smart technology, enable car makers and tier one integrators to keep pace with the speed and growth of consumer electronics and Internet of Things (IoT) industry. The new solutions deliver high-speed connectivity within and beyond the vehicle, providing Internet, cloud applications and entertainment content via telematics or hot spot connections.
Broadcom now offers the industry’s first 5G WiFi/Bluetooth Smart 2X2 MIMO combo chip with Real Simultaneous Dual Band (RSDB) support as well as a stand-alone tri-mode Bluetooth Smart (version 4.2) system-on-a-chip (SoC). Optimized to meet the rigorous standards of the automotive industry, all products have been tested to AECQ100 automotive environmental stress requirements, are manufactured in TS16949 certified facilities and offer full production part approval process (PPAP) support.
“Broadcom’s new automotive-grade chips enable car makers and tier one suppliers to keep pace with the rapidly evolving mobile and IoT ecosystem by providing immediate access to the latest in wireless connectivity technologies,” said Richard Barrett, Broadcom Director of Automotive Wireless Connectivity. “By tailoring our products to meet the stringent quality and environmental demands of the automotive industry, we can significantly expand our footprint and stay ahead of the competition in this fast-growing market.”
At the heart of the connected car are the semiconductor chips that make connectivity possible. As the development cycle quickens, analysts predict that the number of chips used in vehicles will rise at a dramatic pace. According to recent analyst data from Strategy Analytics, there could be nearly 1,000 chips per vehicle by 2020.